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BY228GP-E3/73

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Features Of BY228GP-E3/73

Superectifier structure for high reliability application
Cavity-free glass-passivated junction
Low forward voltage drop
Typical I R less than 0.1 μA
High forward surge capability
Solder dip 275 °C max. 10 s, per JESD 22-B106
Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

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